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Welcome to our Research Experience For Undergraduates program at Columbus State University (REU@CSU) in Security and Privacy for Mobile Sensing and the Internet of Things! The TSYS School of Computer Science is pleased to host an NSF CISE REU Site in Security and Privacy for Mobile Sensing and the Internet of Things .

In our program, undergraduate students will participate in a 9-week research experience at Columbus State University (Columbus, GA) in researching problems and issues related to security, privacy, authentication, data integrity, and malware for Mobile Sensing and the Internet of Things. This site is supported by the NSF CISE REU program.

Students will be awarded a stipend of $5,400 plus meals, transportation (from/to place of origin in the U.S. and up to $600) and housing allowance. The program incorporates professional development activities. The application process will close on March 12 / 2022. Women, minorities and students with disabilities are encouraged to apply. We expect to host the REU@CSU from May 25 / 2022 to July 28 / 2022. Check our Application instructions for more information about how to apply to our REU opportunity.

To apply, students must be US citizens or permanent residents enrolled at an accredited higher learning institution (including two-year institutions) majoring in undergraduate computer science, cyber security, or computer science-related fields including mathematics, and who have taken relevant coursework in programming. Students must be at least in their second year of their academic studies.


Contact Info:

Alfredo J. Perez, Ph. D.

Associate Professor

TSYS School of Computer Science

E-mail: perez_alfredo at columbusstate.edu


Yesem Peker, Ph. D.

Associate Professor

TSYS School of Computer Science

E-mail: peker_yesem at columbusstate.edu


Please begin the subject of the email with the prefix REU@CSU: <your subject>, where <your subject> is the subject of your e-mail.

We have closed our recruitment for year 2021. If you are interested to receive a notification when we open our process again for year 2022, please use this form to submit your contact information.